Details
- Title: 2023 IEEE XXX International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2023)
- Date/Location: Held 2-4 November 2023, Lima, Peru.
- IEEE #: CFP23D62-POD
- ISBN: 9798350315585
- Pages: 485 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE XXX International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2023)
- Date/Location: Held 2-4 November 2023, Lima, Peru.
- IEEE #: CFP23D62-POD
- ISBN: 9798350315585
- Pages: 485 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2024 )