PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2023. (INTERPACK 2023)

PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2023. (INTERPACK 2023)

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071692
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  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2023
  • Date/Location: Held 24-26 October 2023, San Diego, California, USA.
  • ISBN: 9780791887516
  • Pages: 763 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( May 2024 )

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Tab 4

 
  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2023
  • Date/Location: Held 24-26 October 2023, San Diego, California, USA.
  • ISBN: 9780791887516
  • Pages: 763 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( May 2024 )