Details
- Title: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom 2023)
- Date/Location: Held 26-28 June 2023, Kyoto, Japan.
- IEEE #: CFP23DK5-POD
- ISBN: 9798350333343
- Pages: 817 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE International Conference on Metaverse Computing, Networking and Applications (MetaCom 2023)
- Date/Location: Held 26-28 June 2023, Kyoto, Japan.
- IEEE #: CFP23DK5-POD
- ISBN: 9798350333343
- Pages: 817 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2023 )