Details
- Title: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2023)
- Date/Location: Held 28-31 May 2023, Valetta, Malta.
- IEEE #: CFP23DTI-POD
- ISBN: 9798350341324
- Pages: 135 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 Symposium on Design, Test, Integration & Packaging of MEMS/MOEMS (DTIP 2023)
- Date/Location: Held 28-31 May 2023, Valetta, Malta.
- IEEE #: CFP23DTI-POD
- ISBN: 9798350341324
- Pages: 135 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )