Details
- Title: 2023 IEEE Hot Chips 35 Symposium (HCS 2023)
- Date/Location: Held 27-29 August 2023, Palo Alto, California, USA.
- IEEE #: CFP23HCS-POD
- ISBN: 9798350339086
- Pages: 412 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE Hot Chips 35 Symposium (HCS 2023)
- Date/Location: Held 27-29 August 2023, Palo Alto, California, USA.
- IEEE #: CFP23HCS-POD
- ISBN: 9798350339086
- Pages: 412 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2023 )