Details
- Title: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2023)
- Date/Location: Held 24-27 July 2023, Pulau Pinang, Malaysia.
- IEEE #: CFP23777-POD
- ISBN: 9798350301656
- Pages: 508 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2023)
- Date/Location: Held 24-27 July 2023, Pulau Pinang, Malaysia.
- IEEE #: CFP23777-POD
- ISBN: 9798350301656
- Pages: 508 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )