ELECTROMAGNETIC COMPATIBILITY AND SIGNAL/POWER INTEGRITY. IEEE SYMPOSIUM. 2023. (EMC+SIPI 2023)

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070508
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Details

  • Title: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI 2023)
  • Date/Location: Held 29 July - 4 August 2023, Grand Rapids, Michigan, USA.
  • IEEE #: CFP23EMC-POD
  • ISBN: 9798350309775
  • Pages: 755 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2023 )

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Tab 4

 
  • Title: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI 2023)
  • Date/Location: Held 29 July - 4 August 2023, Grand Rapids, Michigan, USA.
  • IEEE #: CFP23EMC-POD
  • ISBN: 9798350309775
  • Pages: 755 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Oct 2023 )