Details
- Title: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI 2023)
- Date/Location: Held 29 July - 4 August 2023, Grand Rapids, Michigan, USA.
- IEEE #: CFP23EMC-POD
- ISBN: 9798350309775
- Pages: 755 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI 2023)
- Date/Location: Held 29 July - 4 August 2023, Grand Rapids, Michigan, USA.
- IEEE #: CFP23EMC-POD
- ISBN: 9798350309775
- Pages: 755 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2023 )