Details
- Title: 2023 IEEE 3rd International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)
- Date/Location: Held 16-18 June 2023, Xiamen, China.
- IEEE #: CFP23AC9-POD
- ISBN: 9798350337969
- Pages: 293 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE 3rd International Conference on Software Engineering and Artificial Intelligence (SEAI 2023)
- Date/Location: Held 16-18 June 2023, Xiamen, China.
- IEEE #: CFP23AC9-POD
- ISBN: 9798350337969
- Pages: 293 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )