Details
- Title: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2023)
- Date/Location: Held 9-12 July 2023, Boston, Massachusetts, USA.
- IEEE #: CFP23T72-POD
- ISBN: 9781665493536
- Pages: 329 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE International Conference on Flexible and Printable Sensors and Systems (FLEPS 2023)
- Date/Location: Held 9-12 July 2023, Boston, Massachusetts, USA.
- IEEE #: CFP23T72-POD
- ISBN: 9781665493536
- Pages: 329 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )