Details
- Title: 2023 ACM/IEEE International Conference on Technical Debt (TechDebt 2023)
- Date/Location: Held 14-15 May 2023, Melbourne, Australia.
- IEEE #: CFP23P50-POD
- ISBN: 9798350311952
- Pages: 113 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 ACM/IEEE International Conference on Technical Debt (TechDebt 2023)
- Date/Location: Held 14-15 May 2023, Melbourne, Australia.
- IEEE #: CFP23P50-POD
- ISBN: 9798350311952
- Pages: 113 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )