Details
- Title: 2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES 2023)
- Date/Location: Held 29-30 June 2023, Krakow, Poland.
- Editor: Tylman, Wojciech
- IEEE #: CFP23MIX-POD
- ISBN: 9798350313529
- Pages: 284 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 30th International Conference on Mixed Design of Integrated Circuits and System (MIXDES 2023)
- Date/Location: Held 29-30 June 2023, Krakow, Poland.
- Editor: Tylman, Wojciech
- IEEE #: CFP23MIX-POD
- ISBN: 9798350313529
- Pages: 284 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )