Details
- Title: 2023 IEEE Cloud Summit
- Date/Location: Held 6-7 July 2023, Baltimore, Maryland, USA.
- IEEE #: CFP23U01-POD
- ISBN: 9798350322187
- Pages: 95 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 IEEE Cloud Summit
- Date/Location: Held 6-7 July 2023, Baltimore, Maryland, USA.
- IEEE #: CFP23U01-POD
- ISBN: 9798350322187
- Pages: 95 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )