Details
- Title: 2023 46th International Conference on Telecommunications and Signal Processing (TSP 2023)
- Date/Location: Held 12-14 July 2023, Prague, Czech Republic.
- IEEE #: CFP2388P-POD
- ISBN: 9798350303971
- Pages: 292 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )
Description
Members/Attendees
Tab 4
- Title: 2023 46th International Conference on Telecommunications and Signal Processing (TSP 2023)
- Date/Location: Held 12-14 July 2023, Prague, Czech Republic.
- IEEE #: CFP2388P-POD
- ISBN: 9798350303971
- Pages: 292 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2024 )