Details
- Title: 2020 IEEE/ACM International Conference on Software and System Processes (ICSSP 2020)
- Date/Location: Held 26-28 June 2020, Seoul, South Korea.
- IEEE #: CFP20ICX-POD
- ISBN: 9781728166766
- Pages: 194 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: 2020 IEEE/ACM International Conference on Software and System Processes (ICSSP 2020)
- Date/Location: Held 26-28 June 2020, Seoul, South Korea.
- IEEE #: CFP20ICX-POD
- ISBN: 9781728166766
- Pages: 194 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )