THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 22ND 2023. (ITHERM 2023) (2 VOLS)

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069664

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Title: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2023)
Date/Location: Held 30 May - 2 June 2023, Orlando, Florida, USA.
IEEE #: CFP23ITH-POD
ISBN: 9798350321678
Pages: 1,103 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Sep 2023 )

Title: 2023 22nd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm 2023)
Date/Location: Held 30 May - 2 June 2023, Orlando, Florida, USA.
IEEE #: CFP23ITH-POD
ISBN: 9798350321678
Pages: 1,103 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Sep 2023 )