Details
- Title: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2023)
- Date/Location: Held 28 May - 1 June 2023, Hong Kong.
- IEEE #: CFP23ISP-POD
- ISBN: 9798350396836
- Pages: 409 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 35th International Symposium on Power Semiconductor Devices and ICs (ISPSD 2023)
- Date/Location: Held 28 May - 1 June 2023, Hong Kong.
- IEEE #: CFP23ISP-POD
- ISBN: 9798350396836
- Pages: 409 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2023 )