Details
- Title: 2023 1st International Conference on Innovations in High Speed Communication and Signal Processing (IHCSP 2023)
- Date/Location: Held 4-5 March 2023, Bhopal, India.
- IEEE #: CFP23DH3-POD
- ISBN: 9798350345964
- Pages: 546 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )
Description
Members/Attendees
Tab 4
- Title: 2023 1st International Conference on Innovations in High Speed Communication and Signal Processing (IHCSP 2023)
- Date/Location: Held 4-5 March 2023, Bhopal, India.
- IEEE #: CFP23DH3-POD
- ISBN: 9798350345964
- Pages: 546 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2023 )