THERMAL, MECHANICAL AND MULTI-PHYSICS SIMULATION AND EXPERIMENTS IN MICROELECTRONICS AND MICROSYSTEMS. INTERNATIONAL CONFERENCE. 24TH 2023. (EuroSimE 2023)

Item #:

068681

$148.50 - $297.00

Details

Title: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2023)
Date/Location: Held 16-19 April 2023, Graz, Austria.
IEEE #: CFP23566-POD
ISBN: 9798350345988
Pages: 691 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Sep 2023 )

Title: 2023 24th International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2023)
Date/Location: Held 16-19 April 2023, Graz, Austria.
IEEE #: CFP23566-POD
ISBN: 9798350345988
Pages: 691 (1 Vol)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Sep 2023 )