Details
- Title: 2022 IEEE/ACM International Workshop on Hierarchical Parallelism for Exascale Computing (HiPar 2022)
- Date/Location: Held 13-18 November 2022, Dallas, Texas, USA.
- IEEE #: CFP22Z81-POD
- ISBN: 9781665463461
- Pages: 37 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE/ACM International Workshop on Hierarchical Parallelism for Exascale Computing (HiPar 2022)
- Date/Location: Held 13-18 November 2022, Dallas, Texas, USA.
- IEEE #: CFP22Z81-POD
- ISBN: 9781665463461
- Pages: 37 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )