Details
- Title: 2022 International Conference on Engineering and Emerging Technologies (ICEET 2022)
- Date/Location: Held 27-28 October 2022, Kuala Lumpur, Malaysia.
- IEEE #: CFP22M57-POD
- ISBN: 9781665491075
- Pages: 825 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 International Conference on Engineering and Emerging Technologies (ICEET 2022)
- Date/Location: Held 27-28 October 2022, Kuala Lumpur, Malaysia.
- IEEE #: CFP22M57-POD
- ISBN: 9781665491075
- Pages: 825 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )