Details
- Title: 2022 International Conference on Advances in Computing, Communication and Materials (ICACCM 2022)
- Date/Location: Held 10-11 November 2022, Dehradun, India.
- IEEE #: CFP22UAA-POD
- ISBN: 9781665474405
- Pages: 330 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 International Conference on Advances in Computing, Communication and Materials (ICACCM 2022)
- Date/Location: Held 10-11 November 2022, Dehradun, India.
- IEEE #: CFP22UAA-POD
- ISBN: 9781665474405
- Pages: 330 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )