Details
- Title: 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM 2022)
- Date/Location: Held 28-31 October 2022, Xi'an, China.
- IEEE #: CFP22H23-POD
- ISBN: 9781665460583
- Pages: 711 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 7th International Conference on Integrated Circuits and Microsystems (ICICM 2022)
- Date/Location: Held 28-31 October 2022, Xi'an, China.
- IEEE #: CFP22H23-POD
- ISBN: 9781665460583
- Pages: 711 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )