Details
- Title: 2022 3rd International Conference on Embedded & Distributed Systems (EDiS 2022)
- Date/Location: Held 2-3 November 2022, Oran, Algeria.
- IEEE #: CFP22O07-POD
- ISBN: 9798350397550
- Pages: 160 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 3rd International Conference on Embedded & Distributed Systems (EDiS 2022)
- Date/Location: Held 2-3 November 2022, Oran, Algeria.
- IEEE #: CFP22O07-POD
- ISBN: 9798350397550
- Pages: 160 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Mar 2023 )