Details
- Title: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2022)
- Date/Location: Held 12-14 December 2022, Urbana, Illinois, USA.
- IEEE #: CFP22EDP-POD
- ISBN: 9781665491952
- Pages: 134 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE Electrical Design of Advanced Packaging and Systems (EDAPS 2022)
- Date/Location: Held 12-14 December 2022, Urbana, Illinois, USA.
- IEEE #: CFP22EDP-POD
- ISBN: 9781665491952
- Pages: 134 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2023 )