Details
- Title: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME 2022)
- Date/Location: Held 26-29 October 2022, Bucharest, Romania.
- IEEE #: CFP2207I-POD
- ISBN: 9781665461023
- Pages: 238 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE 28th International Symposium for Design and Technology in Electronic Packaging (SIITME 2022)
- Date/Location: Held 26-29 October 2022, Bucharest, Romania.
- IEEE #: CFP2207I-POD
- ISBN: 9781665461023
- Pages: 238 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )