PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2022. (INTERPACK 2022)

PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS. INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION. 2022. (INTERPACK 2022)

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  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2022
  • Date/Location: Held 25-27 October 2022, Garden Grove, California, USA.
  • ISBN: 9780791886557
  • Pages: 613 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jan 2023 )

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Tab 4

 
  • Title: INTERNATIONAL TECHNICAL CONFERENCE AND EXHIBITION ON PACKAGING AND INTEGRATION OF ELECTRONIC AND PHOTONIC MICROSYSTEMS
  • Subtitle: InterPACK2022
  • Date/Location: Held 25-27 October 2022, Garden Grove, California, USA.
  • ISBN: 9780791886557
  • Pages: 613 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: American Society of Mechanical Engineers (ASME)
  • POD Publisher: Curran Associates, Inc. ( Jan 2023 )