Details
- Title: 2022 IEEE Cloud Summit
- Date/Location: Held 20-21 October 2022, Fairfax, Virginia, USA.
- IEEE #: CFP22U01-POD
- ISBN: 9781665451147
- Pages: 125 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE Cloud Summit
- Date/Location: Held 20-21 October 2022, Fairfax, Virginia, USA.
- IEEE #: CFP22U01-POD
- ISBN: 9781665451147
- Pages: 125 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )