Details
- Title: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2022)
- Date/Location: Held 26-28 October 2022, Taipei, Taiwan.
- IEEE #: CFP2259B-POD
- ISBN: 9781665452229
- Pages: 271 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 17th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2022)
- Date/Location: Held 26-28 October 2022, Taipei, Taiwan.
- IEEE #: CFP2259B-POD
- ISBN: 9781665452229
- Pages: 271 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )