Details
- Title: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022)
- Date/Location: Held 28-30 September 2022, Dublin, Ireland.
- IEEE #: CFP22TII-POD
- ISBN: 9781665492300
- Pages: 368 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 28th International Workshop on Thermal Investigations of ICs and Systems (THERMINIC 2022)
- Date/Location: Held 28-30 September 2022, Dublin, Ireland.
- IEEE #: CFP22TII-POD
- ISBN: 9781665492300
- Pages: 368 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )