Details
- Title: 2022 Fourth International Conference on Transdisciplinary AI (TransAI 2022)
- Date/Location: Held 19-21 September 2022, Laguna Hills, California, USA.
- IEEE #: CFP22S76-POD
- ISBN: 9781665471855
- Pages: 161 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 Fourth International Conference on Transdisciplinary AI (TransAI 2022)
- Date/Location: Held 19-21 September 2022, Laguna Hills, California, USA.
- IEEE #: CFP22S76-POD
- ISBN: 9781665471855
- Pages: 161 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2022 )