Details
- Title: 2022 International Conference on Embedded Software (EMSOFT 2022)
- Date/Location: Held 7-14 October 2022, Shanghai, China.
- IEEE #: CFP22MSO-POD
- ISBN: 9781665472999
- Pages: 35 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 International Conference on Embedded Software (EMSOFT 2022)
- Date/Location: Held 7-14 October 2022, Shanghai, China.
- IEEE #: CFP22MSO-POD
- ISBN: 9781665472999
- Pages: 35 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )