Details
- Title: 2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE 2022)
- Date/Location: Held 26-29 August 2022, Chengdu, China.
- IEEE #: CFP22611-POD
- ISBN: 9781665427760
- Pages: 431 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE 9th International Symposium on Microwave, Antenna, Propagation and EMC Technologies for Wireless Communications (MAPE 2022)
- Date/Location: Held 26-29 August 2022, Chengdu, China.
- IEEE #: CFP22611-POD
- ISBN: 9781665427760
- Pages: 431 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Feb 2023 )