Details
- Title: 2022 International Conference on Platform Technology and Service (PlatCon 2022)
- Date/Location: Held 22-24 August 2022, Jeju, South Korea.
- IEEE #: CFP22B77-POD
- ISBN: 9781665459587
- Pages: 97 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 International Conference on Platform Technology and Service (PlatCon 2022)
- Date/Location: Held 22-24 August 2022, Jeju, South Korea.
- IEEE #: CFP22B77-POD
- ISBN: 9781665459587
- Pages: 97 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )