Details
- Title: 2022 3rd International Conference on Next Generation Computing Applications (NextComp 2022)
- Date/Location: Held 6-8 October 2022, Flic-en-Flac, Mauritius.
- IEEE #: CFP22NEY-POD
- ISBN: 9781665469555
- Pages: 194 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )
Description
Members/Attendees
Tab 4
- Title: 2022 3rd International Conference on Next Generation Computing Applications (NextComp 2022)
- Date/Location: Held 6-8 October 2022, Flic-en-Flac, Mauritius.
- IEEE #: CFP22NEY-POD
- ISBN: 9781665469555
- Pages: 194 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jan 2023 )