Details
- Title: 2022 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC 2022)
- Date/Location: Held 19-22 September 2022, Bangkok, Thailand.
- IEEE #: CFP22AK5-POD
- ISBN: 9781665427708
- Pages: 137 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC 2022)
- Date/Location: Held 19-22 September 2022, Bangkok, Thailand.
- IEEE #: CFP22AK5-POD
- ISBN: 9781665427708
- Pages: 137 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2022 )