Details
- Title: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2022)
- Date/Location: Held 11-13 July 2022, Pont-a-Mousson, France.
- IEEE #: CFP22DTI-POD
- ISBN: 9781665491686
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 Symposium on Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP 2022)
- Date/Location: Held 11-13 July 2022, Pont-a-Mousson, France.
- IEEE #: CFP22DTI-POD
- ISBN: 9781665491686
- Pages: 111 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Dec 2022 )