Details
- Title: 2022 10th IEEE International Conference on Mobile Cloud Computing, Services, and Engineering (MobileCloud 2022)
- Date/Location: Held 15-18 August 2022, San Francisco, California, USA.
- IEEE #: CFP22MCC-POD
- ISBN: 9781665498463
- Pages: 31 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 10th IEEE International Conference on Mobile Cloud Computing, Services, and Engineering (MobileCloud 2022)
- Date/Location: Held 15-18 August 2022, San Francisco, California, USA.
- IEEE #: CFP22MCC-POD
- ISBN: 9781665498463
- Pages: 31 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Nov 2022 )