Details
- Title: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022)
- Date/Location: Held 18-21 July 2022, Singapore.
- IEEE #: CFP22777-POD
- ISBN: 9781665498166
- Pages: 418 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022)
- Date/Location: Held 18-21 July 2022, Singapore.
- IEEE #: CFP22777-POD
- ISBN: 9781665498166
- Pages: 418 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )