THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS. IEEE INTERSOCIETY CONFERENCE. 21ST 2022. (iTherm 2022) (2 VOLS)

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065680

$209.50 - $419.00

Details

Title: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm 2022)
Date/Location: Held 31 May - 1 June 2022, San Diego, California, USA.
IEEE #: CFP22ITH-POD
ISBN: 9781665485043
Pages: 1,309 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Nov 2022 )

Title: 2022 21st IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (iTherm 2022)
Date/Location: Held 31 May - 1 June 2022, San Diego, California, USA.
IEEE #: CFP22ITH-POD
ISBN: 9781665485043
Pages: 1,309 (2 Vols)
Format: Softcover
TOC Link: View Table of Contents
Publisher: Institute of Electrical and Electronics Engineers (IEEE)
POD Publisher: Curran Associates, Inc. ( Nov 2022 )