Details
- Title: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT 2022)
- Date/Location: Held 10-13 August 2022, Dalian, China.
- IEEE #: CFP22553-POD
- ISBN: 9781665499064
- Pages: 2,210 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 23rd International Conference on Electronic Packaging Technology (ICEPT 2022)
- Date/Location: Held 10-13 August 2022, Dalian, China.
- IEEE #: CFP22553-POD
- ISBN: 9781665499064
- Pages: 2,210 (3 Vols)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )