Details
- Title: 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2022)
- Date/Location: Held 11-13 August 2022, Lima, Peru.
- IEEE #: CFP22D62-POD
- ISBN: 9781665486378
- Pages: 287 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE XXIX International Conference on Electronics, Electrical Engineering and Computing (INTERCON 2022)
- Date/Location: Held 11-13 August 2022, Lima, Peru.
- IEEE #: CFP22D62-POD
- ISBN: 9781665486378
- Pages: 287 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )