Details
- Title: 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2022)
- Date/Location: Held 12-14 June 2022, Gothenburg, Sweden.
- IEEE #: CFP22M25-POD
- ISBN: 9781665491778
- Pages: 35 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 IMAPS Nordic Conference on Microelectronics Packaging (NordPac 2022)
- Date/Location: Held 12-14 June 2022, Gothenburg, Sweden.
- IEEE #: CFP22M25-POD
- ISBN: 9781665491778
- Pages: 35 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Oct 2022 )