Details
- Title: 2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES 2022)
- Date/Location: Held 23-24 June 2022, Wroclaw, Poland.
- Editor: Tylman, Wojciech
- IEEE #: CFP22MIX-POD
- ISBN: 9781665461764
- Pages: 250 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 29th International Conference on Mixed Design of Integrated Circuits and System (MIXDES 2022)
- Date/Location: Held 23-24 June 2022, Wroclaw, Poland.
- Editor: Tylman, Wojciech
- IEEE #: CFP22MIX-POD
- ISBN: 9781665461764
- Pages: 250 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2022 )