Details
- Title: 2022 IEEE/ACM 9th International Conference on Mobile Software Engineering and Systems (MobileSoft 2022)
- Date/Location: Held 17-18 May 2022, Pittsburgh, Pennsylvania, USA.
- IEEE #: CFP22D49-POD
- ISBN: 9781665490184
- Pages: 137 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE/ACM 9th International Conference on Mobile Software Engineering and Systems (MobileSoft 2022)
- Date/Location: Held 17-18 May 2022, Pittsburgh, Pennsylvania, USA.
- IEEE #: CFP22D49-POD
- ISBN: 9781665490184
- Pages: 137 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Aug 2022 )