Details
- Title: 2022 International Conference on Electronics Packaging (ICEP 2022)
- Date/Location: Held 11-14 May 2022, Sapporo, Japan.
- IEEE #: CFP2289U-POD
- ISBN: 9781665484695
- Pages: 248 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 International Conference on Electronics Packaging (ICEP 2022)
- Date/Location: Held 11-14 May 2022, Sapporo, Japan.
- IEEE #: CFP2289U-POD
- ISBN: 9781665484695
- Pages: 248 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Jul 2022 )