Details
- Title: 2022 IEEE Haptics Symposium (HAPTICS 2022)
- Date/Location: Held 21-24 March 2022, Santa Barbara, California, USA.
- IEEE #: CFP22317-POD
- ISBN: 9781665420303
- Pages: 245 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 IEEE Haptics Symposium (HAPTICS 2022)
- Date/Location: Held 21-24 March 2022, Santa Barbara, California, USA.
- IEEE #: CFP22317-POD
- ISBN: 9781665420303
- Pages: 245 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2022 )