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COMPUTER SCIENCE AND MATERIALS APPLICATIONS. INTERNATIONAL CONFERENCE. 2021.
- Item #:
- 063843
- UPC:
Details
-
Title:
2021 International Conference on Computer Science and Materials Applications
-
Date/Location:
Held 3-5 September 2021, Xi'an, China.
-
Series:
Journal of Physics: Conference Series Volume 2200
-
ISBN:
9781713851653
-
Pages:
200 (1 Vol) (approx)
-
Format:
Softcover
-
Publisher:
Institute of Physics Publishing (IOP)
-
POD Publisher:
Curran Associates, Inc. ( May 2022 )
-
Title:
2021 International Conference on Computer Science and Materials Applications
-
Date/Location:
Held 3-5 September 2021, Xi'an, China.
-
Series:
Journal of Physics: Conference Series Volume 2200
-
ISBN:
9781713851653
-
Pages:
200 (1 Vol) (approx)
-
Format:
Softcover
-
Publisher:
Institute of Physics Publishing (IOP)
-
POD Publisher:
Curran Associates, Inc. ( May 2022 )