Details
- Title: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)
- Date/Location: Held 25-27 April 2022, St Julian, Malta.
- IEEE #: CFP22566-POD
- ISBN: 9781665458375
- Pages: 540 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2022 )
Description
Members/Attendees
Tab 4
- Title: 2022 23rd International Conference on Thermal, Mechanical and Multi-Physics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2022)
- Date/Location: Held 25-27 April 2022, St Julian, Malta.
- IEEE #: CFP22566-POD
- ISBN: 9781665458375
- Pages: 540 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( May 2022 )