ELECTRICAL INSULATION AND DIELECTRIC PHENOMENA. IEEE CONFERENCE. 2021. (CEIDP 2021)

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062527
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  • Title: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2021)
  • Date/Location: Held 12-15 December 2021, Vancouver, British Columbia, Canada.
  • IEEE #: CFP21CID-POD
  • ISBN: 9781665469128
  • Pages: 677 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2022 )

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  • Title: 2021 IEEE Conference on Electrical Insulation and Dielectric Phenomena (CEIDP 2021)
  • Date/Location: Held 12-15 December 2021, Vancouver, British Columbia, Canada.
  • IEEE #: CFP21CID-POD
  • ISBN: 9781665469128
  • Pages: 677 (1 Vol)
  • Format: Softcover
  • TOC Link: View Table of Contents
  • Publisher: Institute of Electrical and Electronics Engineers (IEEE)
  • POD Publisher: Curran Associates, Inc. ( Apr 2022 )