Details
- Title: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2021)
- Date/Location: Held 21-23 December 2021, Taipei, Taiwan.
- IEEE #: CFP2159B-POD
- ISBN: 9781665431927
- Pages: 253 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2022 )
Description
Members/Attendees
Tab 4
- Title: 2021 16th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT 2021)
- Date/Location: Held 21-23 December 2021, Taipei, Taiwan.
- IEEE #: CFP2159B-POD
- ISBN: 9781665431927
- Pages: 253 (1 Vol)
- Format: Softcover
- TOC Link: View Table of Contents
- Publisher: Institute of Electrical and Electronics Engineers (IEEE)
- POD Publisher: Curran Associates, Inc. ( Apr 2022 )